The MWP-200 is a low-temperature plasma equipment specifically designed for surface modification of heat-sensitive materials and surface treatment of electrostatically sensitive PCBs. It significantly enhances surface activity and hydrophilicity while removing organic contaminants from surfaces, all without damaging the substrate due to its ultra-low temperature operation.

Compared to existing plasma equipment on the market, this model features a higher oscillation frequency, allowing electrons in the plasma to gain more energy with lower power input. As a result, the electron density and reactive species density in the plasma are higher, ensuring better consistency.

The equipment generates plasma where the electron temperature is significantly higher than the ion temperature, providing high-energy activity. This allows for effective material surface treatment with minimal thermal effects, preventing thermal decomposition or ablation of the material, making it uniquely valuable in its applications.