1. Removes organic matter, oxides, and other contaminants from the surface, enhancing the hydrophilicity of the chip surface.
2. Improves the surface activity of the lead bonding interface, enhancing the bonding strength of the chip and the uniformity of the bonding wire tension.

    Electronic components or IC chips are the complex foundation of today's electronic products. Modern IC chips include the packaging of electronic devices, where the devices are printed onto a crystal and connected to a "package" that contains the electrical connections to the printed circuit board (PCB) onto which the IC chip is soldered. The IC chip's package also provides a method for transferring signals from the crystal, and in some cases, it includes a flexible circuit board around the crystal itself. When the IC chip contains a flexible circuit board, the electrical connections on the crystal are bonded to pads on the flexible circuit board, which is then soldered to the package.
     Traditional electronic components use wet cleaning methods, and some components on the circuit board, such as crystal oscillators, have metal housings. After cleaning, it is difficult to dry the water inside the components, and using alcohol and natural water for manual cleaning has strong odors, low cleaning efficiency, and waste of labor costs. Plasma cleaning, on the other hand, uses active plasma to induce physical or chemical changes on the material surface through single or dual effects, thereby removing or modifying surface contaminants at the molecular level. The plasma cleaning machine can be effectively used in the IC packaging process to remove organic residue, micro-particle contaminants, oxide thin layers, and improve surface activity, preventing delamination or cold solder joints.